Integrated circuit packaging system having dual sided connection and method of manufacture thereof

ABSTRACT

A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a continuation of U.S. patent application Ser. No. 12/413,302filed Mar. 27, 2009, now U.S. Pat. No. 7,923,290.

TECHNICAL FIELD

The present invention relates generally to an integrated circuitpackaging system, and more particularly to an integrated packagingsystem with a dual sided connection.

BACKGROUND ART

Increased miniaturization of components, greater packaging density ofintegrated circuits (“ICs”), higher performance, and lower cost areongoing goals of the computer industry. Semiconductor package structurescontinue to advance toward miniaturization, to increase the density ofthe components that are packaged therein while decreasing the sizes ofthe products that are made therefrom. This is a response to continuallyincreasing demands on information and communication products forever-reduced sizes, thicknesses, and costs along with ever-increasingperformance.

These increasing requirements for miniaturization are particularlynoteworthy, for example, in portable information and communicationdevices such as cellular phones, hands-free cellular phone headsets,personal data assistants (“PDA's”), camcorders, notebook computers, andso forth. All of these devices continue to be made smaller and thinnerto improve their portability. Accordingly, large-scale IC (“LSI”)packages that are incorporated into these devices are required to bemade smaller and thinner. The package configurations that house andprotect LSI require them to be made small and thinner as well.

Many conventional semiconductor (or “chip”) packages are of the typewhere a semiconductor die is molded into a package with a resin, such asan epoxy molding compound. Numerous package approaches stack multipleintegrated circuit dice or package in package (PIP) or a combination.Other approaches include package level stacking or package on package(POP).

Thus, a need still remains for an integrated circuit packaging systemproviding high connectivity, low cost manufacturing, and reduced size.In view of the ever-increasing need to save costs and improveefficiencies, it is increasingly critical that answers be found to theseproblems. In view of the ever-increasing commercial competitivepressures, along with growing consumer expectations and the diminishingopportunities for meaningful product differentiation in the marketplace,it is critical that answers be found for these problems. Additionally,the need to reduce costs, improve efficiencies and performance, and meetcompetitive pressures adds an even greater urgency to the criticalnecessity for finding answers to these problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method of manufacture of an integratedcircuit packaging system including: mounting an integrated circuit,having a device through via and a device interconnect, over a substratewith the device through via traversing the integrated circuit and thedevice interconnect attached to the device through via; attaching aconductive support over the substrate with the conductive supportadjacent to the integrated circuit; providing a pre-formed interposer,having an interposer through via and a pre-attached interconnect, withthe pre-attached interconnect attached to the interposer through via;mounting the pre-formed interposer over the integrated circuit and theconductive support with the pre-attached interconnect over the devicethrough via; and forming an encapsulation over the substrate coveringthe integrated circuit, the conductive support, and partially coveringthe pre-formed interposer.

The present invention provides an integrated circuit packaging system,including: a substrate; an integrated circuit, having a device throughvia and a device interconnect, over the substrate with the devicethrough via traversing the integrated circuit and the deviceinterconnect attached to the device through via; a conductive supportover the substrate with the conductive support adjacent to theintegrated circuit; a pre-formed interposer, having an interposerthrough via and a pre-attached interconnect, with the pre-attachedinterconnect attached to the interposer through via including thepre-formed interposer having the characteristics of the pre-attachedinterconnect pre-attached to a carrier of the pre-formed interposer, andthe pre-formed interposer over the integrated circuit and the conductivesupport with the pre-attached interconnect over the device through via;and an encapsulation over the substrate covering the integrated circuit,the conductive support, and partially covering the pre-formedinterposer.

Certain embodiments of the invention have other steps or elements inaddition to or in place of those mentioned above. The steps or elementwill become apparent to those skilled in the art from a reading of thefollowing detailed description when taken with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of the integrated circuit packaging system in afirst embodiment of the present invention.

FIG. 2 is a cross-sectional view of the integrated packaging systemalong line 2-2 of FIG. 1.

FIG. 3 is a cross-sectional view of the pre-formed interposer having thepre-attached interconnects.

FIG. 4 is a top view of an integrated circuit package-on-package systemwith the integrated circuit packaging system of FIG. 1 in a secondembodiment of the present invention.

FIG. 5 is a cross-sectional view of the integrated circuitpackage-on-package system along line 5-5 of FIG. 4.

FIG. 6 is a flow chart of a method of manufacture of an integratedcircuit packaging system in a further embodiment of the presentinvention.

BEST MODE FOR CARRYING OUT THE INVENTION

The following embodiments are described in sufficient detail to enablethose skilled in the art to make and use the invention. It is to beunderstood that other embodiments would be evident based on the presentdisclosure, and that system, process, or mechanical changes may be madewithout departing from the scope of the present invention.

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known circuits, system configurations, and process steps are notdisclosed in detail.

The drawings showing embodiments of the system are semi-diagrammatic andnot to scale and, particularly, some of the dimensions are for theclarity of presentation and are shown exaggerated in the drawing FIGs.Similarly, although the views in the drawings for ease of descriptiongenerally show similar orientations, this depiction in the FIGs. isarbitrary for the most part. Generally, the invention can be operated inany orientation.

The same numbers are used in all the drawing FIGs. to relate to the sameelements. The embodiments have been numbered first embodiment, secondembodiment, etc. as a matter of descriptive convenience and are notintended to have any other significance or provide limitations for thepresent invention.

For expository purposes, the term “horizontal” as used herein is definedas a plane parallel to the plane or surface of the integrated circuit,regardless of its orientation. The term “vertical” refers to a directionperpendicular to the horizontal as just defined. Terms, such as “above”,“below”, “bottom”, “top”, “side” (as in “sidewall”), “higher”, “lower”,“upper”, “over”, and “under”, are defined with respect to the horizontalplane, as shown in the figures. The term “on” means that there is directcontact among elements.

The term “processing” as used herein includes deposition of material orphotoresist, patterning, exposure, development, etching, cleaning,and/or removal of the material or photoresist as required in forming adescribed structure.

Referring now to FIG. 1, therein is shown a top view of an integratedcircuit packaging system 100 in a first embodiment of the presentinvention. The top view of the integrated circuit packaging system 100depicts a pre-formed interposer 102, such as a pre-formed through viainterposer or a preformed organic interposer. The pre-formed interposer102 can include a mounting contact 104. An encapsulation 106, such as acover including an epoxy molding compound, can surround the pre-formedinterposer.

For illustrative purposes, the integrated circuit packaging system 100is shown with the mounting contact 104 in an array configuration,although it is understood that the integrated circuit packaging system100 can have a different configuration with the mounting contact 104.For example, the mounting contact 104 can form a peripheralconfiguration or an array configuration with some of the array locationdepopulated.

Referring now to FIG. 2, therein is shown a cross-sectional view of theintegrated circuit packaging system 100 along line 2-2 of FIG. 1. Thecross-sectional view of the integrated circuit packaging system 100depicts the pre-formed interposer 102 within the encapsulation 106. Thepre-formed interposer 102 is pre-formed with pre-attached interconnects208 attached thereto.

The cross-sectional view also depicts an active side 210 of anintegrated circuit 212, such as an integrated circuit die or a flipchip, facing a substrate 214, such as a laminated substrate or a printedcircuit board.

A device through via 216, such as through silicon via, can include amounting pad 218 at a non-active side 220 of the integrated circuit 212.The device through via 216 traverses the integrated circuit 212 from theactive side 210 to the non-active side 220.

The pre-formed interposer 102 includes a carrier 222, such as a throughvia interposer or an organic interposer, and the pre-attachedinterconnects 208, such as solder on pad (SOP) bump or otherpre-attached conductive protrusion, attached thereto. The mounting pad218 can be attached to the pre-attached interconnects 208.

The device through via 216 can be coupled to the substrate 214. Aconductive support 224, such as a solder ball, a conductive post, or aconductive column, can be mounted over the substrate 214 and adjacent tothe integrated circuit 212.

The integrated circuit 212 can include a device interconnect 226, suchas a solder ball, conductive bump, or a conductive post, between thedevice through via 216 and the substrate 214. The device interconnect226 can also attach between the active side 210 and the substrate 214without attaching to the device through via 216.

The encapsulation 106 can be coplanar with the exposed portion of thepre-formed interposer 102. The encapsulation surrounds the pre-attachedinterconnects 208. The integrated circuit packaging system 100 has thecharacteristic of robust connection between the pre-attachedinterconnects 208 and the carrier 222 of the pre-formed interposer 102such that the mechanical and electrical connection breaks or gaps havebeen eliminated or reduced. The pre-forming the pre-attachedinterconnects 208 with the carrier 222 ensure robust bond therebyreducing breakage during the formation of the encapsulation 106.

An external interconnect 228, such as solder balls or conductive bumps,can attach under the substrate 214. The conductive support 224 can beattached to the pre-formed interposer 102. The conductive support 224can be coupled to the mounting contact 104. The pre-attachedinterconnects 208 can be attached to the mounting pad 218 coupled to thedevice through via 216 at the non-active side 220. The pre-attachedinterconnects 208 can be coupled to the mounting contact 104.

Referring now to FIG. 3, therein is shown a cross-sectional view of thepre-formed interposer 102 having the pre-attached interconnects 208. Thepre-formed interposer 102 includes an interposer through via 330, suchas an electrical connection structure including a conductive material,copper solder or tungsten. The interposer through via 330 can be athrough silicon via or an electrical via. The pre-attached interconnects208 can be attached to the interposer through via 330.

The interposer through via 330 traverses the pre-formed interposer 102from a pre-formed interposer non-active side 332 to a pre-formedinterposer active side 334. The interposer active side 334 includesactive circuitry thereon. The interposer non-active side 332 does notinclude active circuitry thereon. The interposer through via 330 allowsconnection from the outside to the interior of the integrated circuitpackaging system 100 of FIG. 2 as well as to the external interconnect228 of FIG. 2.

For illustrative purposes, the pre-formed interposer 102 is shown withthe pre-attached interconnects 208 attached to the interposer throughvia 330, although it is understood that the pre-formed interposer 102can have a different configuration with the pre-attached interconnects208. For example, the pre-formed interposer 102 can have thepre-attached interconnects 208 attached to the carrier 222 but notnecessarily to the interposer through via 330.

The pre-formed interposer 102 can be formed and tested to ensurereliable mechanical and electrical connection between the carrier 222and the pre-attached interconnects 208. The pre-attachment ensure therobust connection between the carrier 222 and the pre-attachedinterconnects 208 is maintained with the mounting over the conductivesupport 224 of FIG. 2. If interconnects are applied to the non-activeside 222 of FIG. 2 instead of pre-attached to the carrier 222, heightvariations of the conductive support 224 can cause poor or no connectionto the carrier 222.

Referring now to FIG. 4, therein is shown a top view of an integratedcircuit package-on-package system 400 with the integrated circuitpackaging system 100 of FIG. 1 in a second embodiment of the presentinvention. The top view depicts a mounting device 402, such as anintegrated circuit die, a flip chip, or a packaged integrated circuit.

Referring now to FIG. 5, therein is shown a cross-sectional view of theintegrated circuit package-on-package system 400 along line 5-5 of FIG.4. The cross-sectional view depicts the mounting device 402 mounted overthe integrated circuit packaging system 100. A mounting interconnect 502of the mounting device 402 can attach to the pre-formed interposer 102.The mounting interconnect 502 can attach to the interposer through via330.

It has been discovered that the present invention provides theintegrated circuit packaging system having a pre-formed interposerprovides reliable connection structure. The integrated circuit packagingsystem has the characteristics of being formed with the pre-formedinterposer. The pre-attached interconnects to the carrier to form thepre-formed interposer reduces or eliminates poor or weak connectionsbetween the pre-attached interconnects and the carrier thereby improvingreliability during the encapsulating process. Furthermore, the use of apre-formed interposer provides increased interconnection performancewhen used with flip chips or other high I/O devices.

It has also been discovered that the present invention provides theintegrated circuit packaging system having a dual connectivity andcompact footprint. The pre-formed interposer with the interposer thoughvia along with the pre-attached interconnects provide dual connectivityfrom above and below the integrated packaging system. The device throughvia and the interposer through via allow the integrated circuit to beelectronically coupled to the pre-formed interposer eliminating the needfor additional connection structures such as solder balls that canrequire additional footprint space. Furthermore, the use of a pre-formedinterposer can increase the ease of mounting an additional package ontop of the integrated circuit package.

Thus, it has been discovered that the integrated circuit packaging ofthe present invention furnishes important and heretofore unknown andunavailable solutions, capabilities, and functional aspects for dualconnectivity with the integrated circuit packaging system.

Referring now to FIG. 6, therein is shown a flow chart of a method 600of manufacture of an integrated circuit packaging system 100 in afurther embodiment of the present invention. The method 600 includes:mounting an integrated circuit, having a device through via and a deviceinterconnect, over a substrate with the device through via traversingthe integrated circuit and the device interconnect attached the devicethrough via in a block 602; attaching a conductive support over thesubstrate with the conductive support adjacent to the integrated circuitin a block 604; providing a pre-formed interposer, having an interposerthrough via and a pre-attached interconnect, with the pre-attachedinterconnect attached to the interposer through via in a block 606;mounting the pre-formed interposer over the integrated circuit and theconductive support with the pre-attached interconnect over the devicethrough via in a block 608; and forming an encapsulation over thesubstrate covering the integrated circuit, the conductive support, andpartially covering the pre-formed interposer in a block 610.

The resulting method, process, apparatus, device, product, and/or systemis straightforward, cost-effective, uncomplicated, highly versatile andeffective, can be surprisingly and unobviously implemented by adaptingknown technologies, and are thus readily suited for efficiently andeconomically manufacturing integrated packaging systems.

Another important aspect of the present invention is that it valuablysupports and services the historical trend of reducing costs,simplifying systems, and increasing performance.

These and other valuable aspects of the present invention consequentlyfurther the state of the technology to at least the next level.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations that fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

What is claimed is:
 1. A method of manufacture of an integrated circuitpackaging system comprising: mounting an integrated circuit, having adevice through via and a device interconnect, over a substrate with thedevice through via traversing the integrated circuit and the deviceinterconnect attached to the device through via; attaching a conductivepost over the substrate with the conductive post adjacent to theintegrated circuit; providing a pre-formed interposer, having aninterposer through via and a pre-attached interconnect, with thepre-attached interconnect attached to the interposer through via;mounting the pre-formed interposer over the integrated circuit and theconductive post with the pre-attached interconnect over the devicethrough via; and forming an encapsulation over the substrate coveringthe integrated circuit, the conductive post, and covering vertical edgesof the pre-formed interposer.
 2. The method as claimed in claim 1wherein mounting the pre-formed interposer over the integrated circuitand the conductive post with the pre-attached interconnect over thedevice through via includes electrically coupling the pre-attachedinterconnect and the device through via.
 3. The method as claimed inclaim 1 wherein forming the encapsulation over the substrate coveringthe integrated circuit, the conductive post, and partially covering thepre-formed interposer includes exposing the interposer through via. 4.The method as claimed in claim 1 wherein forming the encapsulation overthe substrate covering the integrated circuit, the conductive post, andpartially covering the pre-formed interposer includes forming theencapsulation coplanar with the exposed portion of the pre-formedinterposer.
 5. The method as claimed in claim 1 wherein providing thepre-formed interposer, having the interposer through via and thepre-attached interconnect, with the pre-attached interconnect attachedto the interposer through via includes providing the pre-formedinterposer having a pre-attached solder on pad bump.
 6. A method ofmanufacture of an integrated circuit packaging system comprising:mounting an integrated circuit, having a device through via and a deviceinterconnect, over a substrate with the device through via traversingthe integrated circuit and the device interconnect attached to thedevice through via and the substrate; attaching a conductive post overthe substrate with the conductive post adjacent to the integratedcircuit; providing a pre-formed interposer, having an interposer throughvia and a pre-attached interconnect, with the pre-attached interconnectattached to the interposer through via; mounting the pre-formedinterposer over the integrated circuit and the conductive post with thepre-attached interconnect over the device through via; and forming anencapsulation over the substrate covering the integrated circuit, theconductive post, and covering vertical edges of the pre-formedinterposer with the encapsulation coplanar with the exposed top portionof the pre-formed interposer.
 7. The method as claimed in claim 6wherein mounting the pre-formed interposer over the integrated circuitand the conductive post with the pre-attached interconnect over thedevice through via includes electrically coupling the pre-attachedinterconnect and the conductive post.
 8. The method as claimed in claim6 wherein providing the pre-formed interposer includes providing anorganic interposer.
 9. The method as claimed in claim 6 furthercomprising connecting a mounting device and the device through via. 10.The method as claimed in claim 6 wherein mounting the integrated circuitincludes mounting a flip chip.
 11. An integrated circuit packagingsystem comprising: a substrate; an integrated circuit, having a devicethrough via and a device interconnect, over the substrate with thedevice through via traversing the integrated circuit and the deviceinterconnect attached to the device through via; a conductive post overthe substrate with the conductive post adjacent to the integratedcircuit; a pre-formed interposer, having an interposer through via and apre-attached interconnect, with the pre-attached interconnect attachedto the interposer through via including: the pre-formed interposerhaving the characteristics of the pre-attached interconnect pre-attachedto a carrier of the pre-formed interposer, and the pre-formed interposerover the integrated circuit and the conductive post with thepre-attached interconnect over the device through via; and anencapsulation over the substrate covering the integrated circuit, theconductive post, and covering vertical edges of the pre-formedinterposer.
 12. The system as claimed in claim 11 wherein thepre-attached interconnect is electrically coupled to the device throughvia.
 13. The system as claimed in claim 11 wherein the encapsulationexposes the interposer through via.
 14. The system as claimed in claim11 wherein the encapsulation is coplanar with the exposed portion of thepre-formed interposer.
 15. The system as claimed in claim 11 wherein thepre-attached interconnect includes a pre-attached solder on pad bump.16. The system as claimed in claim 11 wherein: the device interconnectis attached to the substrate; and the encapsulation is coplanar with theexposed top portion of the pre-formed interposer.
 17. The system asclaimed in claim 16 wherein the pre-formed interposer is electricallycoupled to the conductive post.
 18. The system as claimed in claim 16wherein the pre-formed interposer includes an organic interposer. 19.The system as claimed in claim 16 further comprising a mounting deviceconnected to the device through via.
 20. The system as claimed in claim16 wherein the integrated circuit includes a flip chip.